A300 13SLOTS FOUPs_300mm_cassette/ box/FOUP_Products_Yuanxinhu(Shanghai)Microelectronics ，Ltd

A300 13SLOTS FOUPs

For Thick and Warped Wafer

Are specifically designed for supporting heavy thick and warped wafers while providing superior microenvironment control that provides clean and secure 300 mm wafer transport.

The 13-capacity design provides additional support for thick and warped wafers while providing extra room for automation to transfer wafers.
Purge options are available including front/rear purge that provides maximum gas dispersion
Industry-proven door provides equipment interoperability and long life

Integral wafer supports allow excellent wafer plane performance and reliable wafer access

A300 Thick and Warped Wafer FOUPs Applications

FOUP platform that provides clean and secure transport and handling of thick, bonded, 3D-IC, and warped 300 mm wafers
Automation compatibility provides a low cost of ownership

Specifications

Drawings

Product Specifications

		13 Capacity
Materials of construction	Shell, door housing, door panels	Ultrapure polycarbonate (PC)
	Wafer supports and contact areas (shell, door housing, door components)	Carbon-filled PEI material
	Door seal	Thermoplastic elastomer
Dimensions	Width	426 mm (16.8")
	Depth	355 mm (14.0")
	Height	338 mm (13.3")
Weight	Empty	5.1 kg (11.3 lb)
Weight	With wafers	Dependson wafer thickness
Wafer spacing		20 mm (0.78")


Configuration Options
Shell and door colors options	PC clear
Purge options	Front/rear standard purge
Segregation options	Configurable info pads
Identification options	Colored handles - amber, black, blue, green, red, white, yellow Colored cardholders - amber, green, white Bar code and alphanumeric character labels RFID tags with read/write capability

A300 13SLOTS FOUPs

Specifications

Configuration Options